Electronic Hot Melt Adhesive

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Electronic Hot Melt Adhesive

Our electronic hot melt adhesive has many advantages, such as high peel strength and great resistance to high temperature, heat and chemical corrosion. With good adhesive property, the hot melt glue can bond various plastic and metal substrates firmly, especially substrates of such digital products as mobile phones, computers, etc. Economical and reliable, our products are now widely used in electronic and microelectronic industries.















Specifications

Product Appearance Melt viscosity cp Open time (affected by temperature, substrate) s Sizing temperature ℃ Application
PUR-8665 Water white solid 8000±500/ 120 ℃ 360 110~130 The electronic hot melt adhesive is suitable for bonding plastic substrates.
PUR-8810 Water white solid 6000±500 110 ℃ 90 110~130 It is suitable for bonding a variety of plastic and metal substrates, such as ABS, polycarbonate, FRP, polyester, acrylic, epoxy resin, PVC, aluminum alloy, stainless steel, copper, ferro alloy, etc.

Packing
Our electronic hot melt adhesive is packed in a 30g plastic tube.

With years of experience in the adhesive industry, our company is able to provide an extensive line of hot glue for bonding, coating and sealing of electronic components. With a hot melt tool kit, customers can use our products instantly. However, if the production equipment hasn't been used for a long time, please first clean it before using our adhesive.

We are an electronic hot melt adhesive manufacturer and supplier in China. We provide various types of products such as express (parcel) adhesive, water based glue, PU construction glue and glue gun flushing agent.

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